According to the International Council on Clean Transportation, as of early 2024, there are approximately 40 million electric ...
Department of Optical and Biophysical Systems, Institute of Physics of the Czech Academy of Sciences, Prague 18221, Czech Republic ...
The device is intended for intelligent underwater detection, real-time environmental monitoring, and potentially covert ...
Discover how Archicad 29, AI and integrated tools are transforming architectural design, enhancing creativity and ...
Bharat Electronics Limited (BEL), a Navratna company under the Ministry of Defense, has announced recruitment for the post of ...
Apple’s New Silicon Initiative (NSI) aims to prepare students for careers in hardware technology, computer architecture, and silicon chip design. The program’s objective is to address the growing ...
Abstract: We propose a technology called Bumpless Build Cube (BBCube) 3D for AI and HPC applications which need high bandwidth and power efficiency. BBCube employs bumpless Wafer-on-Wafer (WoW) ...
Abstract: A large number of multiply-accumulate operations and memory accesses required in deep convolutional neural networks (DCNN) leads to high latency and energy consumption (EC), that hinder ...
All eyes are on the chip maker as it prepares a full-court press into a new process technology, spearheaded by chips for ...
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China ...